METHOD AND DEVICE OF SUPPLYING LIQUID RESIN MATERIAL USED FOR COMPRESSION RESIN ENCAPSULATION MOLDING

摘要

PROBLEM TO BE SOLVED: To provide a method and a device of supplying liquid resin material capable of efficiently supplying liquid resin material into a lower mold cavity in a molding apparatus when performing resin encapsulation molding of an electronic component such as semiconductor element by using a small-size compression resin encapsulation molding apparatus. SOLUTION: The method of supplying liquid resin material comprises: a process of measuring a required amount of the liquid resin material stored in a storage tank 121 for the liquid resin material and a required amount of a liquid curing agent stored in a storage tank 122 for the liquid curing agent; a subsequent process of mixing the measured required amounts of the liquid resin material and liquid curing agent to prepare a liquid heat curable resin material; and a subsequent process of conveying the prepared liquid heat curable resin material to the side of a gate nozzle 15. The liquid heat curable resin material conveyed into the gate nozzle 15 is immediately ejected into the lower mold cavity disposed on the under side of the gate nozzle 15. COPYRIGHT: (C)2010,JPO&INPIT