SUBSTRATE HAVING BUILT-IN FUNCTIONAL ELEMENT, METHOD FOR MANUFACTURING SAME, AND ELECTRONIC DEVICE

摘要

Provided is a substrate having a built-in functional element, wherein warpage of the substrate due to a difference between linear thermal expansion coefficients is suppressed, while achieving thinness and maintaining normal operations of the functional element.  The substrate having the built-in functional element is provided with, on a base material, one or more functional elements and an insulating layer which embeds the functional element therein.  In the insulating layer, a reinforcing material is embedded over the entire surface of the substrate on the sides of the functional element, and the reinforcing material overlaps at least a part of the peripheral section of the functional element with a length of one ten thousandth or more but not more than one tenth of the length or the width of the circuit surface of the functional element.