INTEGRATED CIRCUIT COOLING APPARATUS

摘要

An apparatus for cooling a computer's microprocessor (32) includes a thermal housing (24) having a receiving aperture (42) in alignment with the microprocessor (32). A thermal head (38) is inserted into and guided by the receiving aperture (42) such that a cooled surface (40) of the thermal head (38) will be in thermal contact with the microprocessor (32). The thermal head (38) defines a flow channel (48) for passage of a refrigerant fluid so as to cause cooling at the cooled surface (40). A clamping arrangement (88) is attached to the mounting structure to maintain the thermal head in operative position. The apparatus further includes a refrigeration system in fluid communication with the flow channel of the thermal head to supply refrigerant fluid thereto.