| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper-clad laminated sheet which solves the nonconformity of conventional methods and has excellent blanking workability such as crack resistance and interlayer exfoliation resistance, and to provide a printed circuit board. SOLUTION: The copper-clad laminated sheet is obtained by heating and pressure-molding a resin-containing prepreg and copper foil with an adhesive layer wherein the thickness of the adhesive layer is 0.5 to 10μm and the average roughness of a surface of the copper foil in contact with the adhesive layer is 2.0μm or lower. In the copper-clad laminated sheet, a rate of the total elongation of the resin at 20°C after the curing of the prepreg is 7% or smaller and a rate of the total elongation of the adhesive layer at 20°C is larger than that of the prepreg by 3% or more. The printed circuit board is manufactured by using the copper-clad laminated sheet. COPYRIGHT: (C)2010,JPO&INPIT
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