| 摘要 |
PURPOSE: A light emitting device package of an array structure is provided minimize loss of a light emitting diode in a bonding process. CONSTITUTION: A light emitting device package(100) comprises a package substrate(107), first and second electrode pads(108a,108b), a light emitting device, and an anisotropic conductive film. First and second electrode pads are formed on one side of the package substrate and have different polarities. The light emitting device has the first and second electrodes with different polarities. An anisotropic conductive film bonds the light emitting device with the package substrate while the first and second electrode pads are electrically connected to the first and second electrode. The anisotropic conductive film is interposed between the light emitting device and the first and second electrode pads.
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