发明名称 PHOTOELECTROCHEMICAL ETCHING FOR CHIP SHAPING OF LIGHT EMITTING DIODES
摘要 A photoelectrochemical (PEC) etch is performed for chip shaping of a device comprised of a III-V semiconductor material, in order to extract light emitted into guided modes trapped in the III-V semiconductor material. The chip shaping involves varying an angle of incident light during the PEC etch to control an angle of the resulting sidewalls of the III-V semiconductor material. The sidewalls may be sloped as well as vertical, in order to scatter the guided modes out of the III-V semiconductor material rather than reflecting the guided modes back into the III-V semiconductor material. In addition to shaping the chip in order to extract light emitted into guided modes, the chip may be shaped to act as a lens, to focus its output light, or to direct its output light in a particular way.
申请公布号 US2010090240(A1) 申请公布日期 2010.04.15
申请号 US20090576946 申请日期 2009.10.09
申请人 THE REGENTS OF THE UNIVERSITY OF CALIFORNIA 发明人 TAMBOLI ADELE;HU EVELYN L.;SPECK JAMES S.
分类号 H01L33/00;H01L21/306;H01L21/78 主分类号 H01L33/00
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