| 摘要 |
<P>PROBLEM TO BE SOLVED: To attach a film to a substrate while preventing the substrate from being damaged and preventing bubbles from being contained between the film and the substrate. Ž<P>SOLUTION: A film attaching apparatus includes a vacuum container 20 having an airtight space at the inside, a film (corresponding to a first substrate 12) which partitions the airtight space into a vacuum chamber 90 located at a lower position and a first buffer space 32 located at a higher position, a holding pedestal 24 which holds the substrate 14, a lift means 120 which moves the holding pedestal 24 upward while the substrate 14 is placed in the vacuum chamber 90 and is held by the holding pedestal 24, and first and second gas charging/discharging means which discharge and charge gas from and to the vacuum chamber 90 and the first buffer space 32, respectively. When the first and second gas charging/discharging means discharge gas from the vacuum chamber 90 and the first buffer space 32, so that the vacuum chamber 90 has a vacuum atmosphere in which the pressure is lower than atmospheric pressure, the substrate 14 is moved toward the film 12 by the lift means 120. After the substrate 14 is brought into contact with the film 12, gas having a pressure higher than the pressure of the vacuum chamber 90 is supplied to the first buffer space 32, whereby the film 12 is pressed downward and attached to the substrate 14. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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