METHOD OF FORMING PROTECTIVE FILM FOR WAFER

摘要

PROBLEM TO BE SOLVED: To provide a method of forming a protective film for a wafer forming a protective film in a part other than a notch without forming a protective film in a notch part of the wafer while preventing occurrence of warpage. SOLUTION: This method of forming a protective film for a wafer includes processes of: superposing an epoxy resin sheet 2 of a sheet material 3 formed by arranging the epoxy resin sheet 2 in a semi-cured state on a surface of a carrier material 1 on a surface of a wafer 5 with a notch 4 formed thereon to stick the sheet material 3 thereto; and forming a protective film 6 on the surface of the wafer 5 with the epoxy resin sheet 2 by peeling the carrier material 1. A sheet material wherein extension of the epoxy resin sheet 2 is 0-150% and adhesion force between the carrier material 1 and the epoxy resin sheet 2 is 0.001-0.2 kN/m when executing a tension test for pulling and peeling the epoxy resin sheet 2 from the carrier material 1 at a speed of 10 mm/min in an environment at 25±2°C until being ruptured is used as the sheet material. COPYRIGHT: (C)2010,JPO&INPIT