发明名称 |
Drawn Dummy FeCAP, Via and Metal Structures |
摘要 |
An integrated circuit containing hydrogen permeable dummy vias configured in a linear or rectangular array and symmetrically positioned over a component in the integrated circuit. An integrated circuit containing matching components with identical layouts and hydrogen permeable dummy vias in identical configurations over the matching components. A process of forming an integrated circuit containing matching components with identical layouts and hydrogen permeable dummy vias in identical configurations over the matching components.
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申请公布号 |
US2010090340(A1) |
申请公布日期 |
2010.04.15 |
申请号 |
US20090576340 |
申请日期 |
2009.10.09 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
SUMMERFELT SCOTT R.;AGGARWAL RAJNI J. |
分类号 |
H01L23/48;H01L21/768 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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