| 摘要 |
PROBLEM TO BE SOLVED: To improve the heat dissipation property of a double-sided heat dissipation semiconductor device without increasing the plane size of a heatsink. SOLUTION: A semiconductor device 100 includes a semiconductor element 1; heatsinks 2 and 3 electrically and thermally joined to the front surface and rear surface of the semiconductor element 1, respectively; and cooling devices 9 thermally joined to heat dissipation surfaces 2b and 3b of the heatsinks 2 and 3 which are surfaces opposite to the semiconductor element 1. A projected portion of the semiconductor element 1 on each heat dissipation surface 2b and 3b of each heatsink 2 and 3 is a convex portion 10 projecting toward the cooling devices 9 which face the heat dissipation surfaces 2b and 3b. Meanwhile, a portion of each cooling device 9 which faces the corresponding convex portion 10 is a concave portion 11. Each of the convex portions 10 is engaged with one of the concave portions 11. Between each of the convex portions 10 and one of the concave portions 11, an insulation film 12 is formed to electrically insulate the convex portion 10 and the concave portion 11. The convex portion 10 and the concave portion 11 are in contact with each other via the insulation film 12. COPYRIGHT: (C)2010,JPO&INPIT |
