| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a flip chip mounting structure object which secures a transfer amount of a conductive adhesive for absorbing waviness of a ceramic substrate and dispersion of height of a stud bump in a semiconductor element, and which has a high mounting yield. <P>SOLUTION: In the flip chip mounting structure object, the stud bump 1 consists of a seating part 8 and a head part 9. A boundary part with the seating part 8 in the head part 9 has a taper part 9a where a part near an end becomes narrower. When a diameter of a base of the taper part 9a is set at D1 and a diameter of the seating part 8 at D2, the stud bump is formed to become D2×0.6<D1<D2×0.8. <P>COPYRIGHT: (C)2010,JPO&INPIT |
