发明名称 |
PLASMA PROCESSING SYSTEMS WITH MECHANISMS FOR CONTROLLING TEMPERATURES OF COMPONENTS |
摘要 |
A plasma processing system with improved component temperature control is disclosed. The system may include a plasma processing chamber having a chamber wall. The system may also include an electrode disposed inside the plasma processing chamber. The system may also include a support member disposed inside the plasma processing chamber for supporting the electrode. The system may also include a support plate disposed outside the chamber wall. The system may also include a cantilever disposed through the chamber wall for coupling the support member with the support plate. The system may also include a lift plate disposed between the chamber wall and the support plate. The system may also include thermally resistive coupling mechanisms for mechanically coupling the lift plate with the support plate. |
申请公布号 |
WO2009152259(A3) |
申请公布日期 |
2010.04.15 |
申请号 |
WO2009US46931 |
申请日期 |
2009.06.10 |
申请人 |
LAM RESEARCH CORPORATION;TAPPAN, JAMES E. |
发明人 |
TAPPAN, JAMES E. |
分类号 |
H01L21/3065 |
主分类号 |
H01L21/3065 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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