发明名称 PLASMA PROCESSING SYSTEMS WITH MECHANISMS FOR CONTROLLING TEMPERATURES OF COMPONENTS
摘要 A plasma processing system with improved component temperature control is disclosed. The system may include a plasma processing chamber having a chamber wall. The system may also include an electrode disposed inside the plasma processing chamber. The system may also include a support member disposed inside the plasma processing chamber for supporting the electrode. The system may also include a support plate disposed outside the chamber wall. The system may also include a cantilever disposed through the chamber wall for coupling the support member with the support plate. The system may also include a lift plate disposed between the chamber wall and the support plate. The system may also include thermally resistive coupling mechanisms for mechanically coupling the lift plate with the support plate.
申请公布号 WO2009152259(A3) 申请公布日期 2010.04.15
申请号 WO2009US46931 申请日期 2009.06.10
申请人 LAM RESEARCH CORPORATION;TAPPAN, JAMES E. 发明人 TAPPAN, JAMES E.
分类号 H01L21/3065 主分类号 H01L21/3065
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