| 摘要 |
PURPOSE: A transmitting/receiving module of the frequency band for the radar reduces the maintenance cost by alternating only the target substrate of the failure state. CONSTITUTION: A radio-frequency circuit part including high frequency single integrated circuit(monolithic microwave integrated circuit: MMIC) chips(129a, 129b, 129c) is offered to a duroid substrate(102). The control CPU offering the control signal controlling the radio-frequency circuit part is formed in the multilayer circuit board(103). The carrying hole(131) is formed in the multilayer circuit board. The multilayer circuit board is laminated in the upper of the duroid substrate. The MMIC chip is projected in the single-side of the duroid substrate. The MMIC chip is accepted to the carrying hole. In the around the MMIC chip is the carrying hole, it is connected to wires bonded in the multilayer circuit board to the multilayer circuit board.
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