发明名称 WIRE SAW DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a wire saw device capable of suppressing the chipping of a cut piece and irregularity in the thickness while enhancing the cutting efficiency. <P>SOLUTION: The wire saw device includes a pair of guide rollers 11 arranged in parallel with and separated from each other in the direction x, and a pair of guide rollers 12 arranged in parallel with and separate from each other in the direction x, and arranged separated from the pair of guide rollers 11 in the direction y. The wire saw device has a cut section 21 against which a solar cell material Ob1 is pressed from the upper side in the direction y with respect to a part supported on an upper part in the direction y of the pair of guide rollers 11 of a wire 2, and a cut section 22 against which a solar cell material Ob2 is pressed from the upper side in the direction y with respect to a part supported on an upper part in the direction y of the pair of guide rollers 12 of the wire 2. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2010076008(A) 申请公布日期 2010.04.08
申请号 JP20080243781 申请日期 2008.09.24
申请人 SUMITOMO METAL FINE TECHNOLOGY CO LTD 发明人 TOYAMA KOHEI
分类号 B24B27/06;H01L21/304;H01L31/04 主分类号 B24B27/06
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