| 摘要 |
An LED chip with enhanced effective reflection angles is revealed, primarily comprising an epitaxial substrate, a first reflection mirror on the epitaxial substrate, a second reflection mirror, a light-emitting mechanism, and a first electrode. The first reflection mirror consists of a plurality of first DBRs with a first paired thickness. The second reflection mirror is formed on the first reflection mirror and consists of a plurality of second DBRs with a second paired thickness. Accordingly, two different ranges of effective reflection angles is provided to increase the effective reflection angles to overcome issues of lower production yield during the conventional thermally-bonding processes with reflection metal plates.
|
