| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device capable of preventing the cracks that occurs when mounting electronic components in a simple yet sure way, and to provide the semiconductor device. Ž<P>SOLUTION: The method is provided for manufacturing the semiconductor device 1 comprising a mounting substrate 400 and an electronic component 100 having a bump 130 electrically connected to the mounting substrate 400 on its active surface, wherein the electronic component 100 is mounted on the mounting substrate 400 through a resin layer 250. In each of a plurality of regions in the formation substrate of the electronic component 100, components of the electronic component 100 including the bump 130 are formed. After that, resin films having groove-shape recesses are formed over a plurality of regions on the formation substrate collectively. Then, the formation substrate is fragmented to form the electronic component 100, and the resin film is fragmented to form the resin layer 250 with a recess 240. Furthermore, the electronic component 100 is adhered to the mounting substrate 400 through the resin layer 250. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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