| 发明名称 |
SEMICONDUCTOR DEVICE AND METHOD OF BONDING WIRES BETWEEN SEMICONDUCTOR CHIP AND WIRING SUBSTRATE |
| 摘要 |
A wiring substrate and a semiconductor chip mounted on the wiring substrate are connected together via a bonding wire. The distance from each end of the semiconductor chip to a wire bond pad provided on the wiring substrate is smaller than the height of the semiconductor chip.
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| 申请公布号 |
US2010084773(A1) |
申请公布日期 |
2010.04.08 |
| 申请号 |
US20090572326 |
申请日期 |
2009.10.02 |
| 申请人 |
ELPIDA MEMORY, INC. |
发明人 |
ITAYA SATOSHI;SASAKI DAI;KATAGIRL MITSUAKI |
| 分类号 |
H01L23/49;H01L21/60 |
主分类号 |
H01L23/49 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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