ADHESIVE COMPOSITION, BONDED MEMBER MADE WITH ADHESIVE COMPOSITION, SUPPORT MEMBER FOR SEMICONDUCTOR MOUNTING, SEMICONDUCTOR DEVICE, AND PROCESSES FOR PRODUCING THESE

摘要

An adhesive composition which comprises, as essential ingredients, a thermosetting resin ingredient (A) which at a temperature of 5-40°C is evenly compatible and mixable without separating out, a high-molecular ingredient (B), and a hardener ingredient (C). After the adhesive composition comes into contact with an adherend and the thermosetting resin ingredient (A) has cured, the thermosetting resin ingredient (A) in the adhesive composition is present as a particulate structure which has separated out, the particulate structure being present in a higher concentration than in the surrounding area in the adhesive composition and present in alarger amount in an area near to that surface of the composition which is in contact with the adherend than in the inner part of the adhesive composition. The adhesive composition can be used in thin-film bonding. It is excellent in heat resistance, crack resistance, and adhesion, and is reduced in oozing and hence has excellent unsusceptibility to oozing.