| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a solder composition capable of forming a solder bump without causing any dispersion in the quality and the height of the solder bump. Ž<P>SOLUTION: The solder composition 10 comprises a large number of solder particles 11, and a liquid 12 (a liquid material) consisting of a mixture of a fatty acid ester oil and iso-stearic acid to be added to the fatty acid ester oil, and is used for forming solder bump on, for example, a pad electrode 22. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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