| 摘要 |
A polyimide precursor and its composition as well as a polyimide laminate are provided. The polyimide precursor and its composition are prepared using a diamine monomer and a dianhydride monomer in a specific composition proportion. The composition is coated on a copper foil and then cured to provide a polyimide laminate with a desired Coefficient of Thermal Expansion (CTE) and exhibiting desired properties, such as film flatness, dimensional stability, peeling strength, tensile strength, and elongation.
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