发明名称 METHOD OF PRODUCING ELECTRIC CIRCUIT, AND ELECTRIC CIRCUIT BOARD OBTAINED BY THE METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a method of producing an electric circuit capable of maintaining high mechanical strength and adhesion strength even when the electric circuit with narrow line width and line interval are formed. <P>SOLUTION: The method of producing an electric circuit includes a film-forming step of forming a resin film 2 on the surface of an insulative substrate 1, a circuit pattern forming step of forming grooves and/or holes having desired shape and depth by performing laser processing or mechanical processing to the insulative substrate from the outer surface of the resin film to form a circuit pattern part, a catalyst-depositing step of depositing a plating catalyst or its precursor on the surface of the circuit pattern part of the insulative substrate and the surface of the resin film 2 coating the insulative substrate 1, a film-peeling step of peeling the resin film from the insulative substrate, and a plating processing step of performing electroless deposition to the insulative substrate from which the resin film is peeled, and in the circuit pattern forming step, a method for plating reinforcement structure at least at a part of the circuit pattern part is used. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2010080946(A) 申请公布日期 2010.04.08
申请号 JP20090195150 申请日期 2009.08.26
申请人 PANASONIC ELECTRIC WORKS CO LTD 发明人 YOSHIOKA SHINGO;FUJIWARA HIROAKI
分类号 H05K3/10;H05K3/18 主分类号 H05K3/10
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