发明名称 PACKAGE FOR HOUSING ELECTRONIC COMPONENT
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an inexpensive package for housing an electronic component, which ensures high reliability in air tightness of a jointing part between a sidewall body and a base body. <P>SOLUTION: The package includes a sidewall body 11 of square tube, which is made from an Fe-Ni-Co based or Fe-Ni based alloy metal, and a base body 13 of rectangular plate, which includes a length dimension being larger than an outside dimension in the major direction of the square and a width dimension almost equal to an outside dimension in the minor direction of the square, and is made from the alloy metal identical to that of the sidewall body 11. The lower end face of the sidewall body 11 is made to abut on the upper surface of the central part in the major direction, to provide a cavity part 14 for housing an electronic component by the inner peripheral sidewall of the sidewall body 11 and the upper surface of central part in the major direction of the base body 13. A heatsink 15 of Cu-W or Cu-Mo is provided on the bottom surface of the cavity part 14 while abutting on and jointing the lower surface thereto with an interval provided to the inner peripheral sidewall surface of the sidewall body 11 of the cavity part 14. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2010080562(A) 申请公布日期 2010.04.08
申请号 JP20080245080 申请日期 2008.09.25
申请人 SUMITOMO METAL ELECTRONICS DEVICES INC 发明人 NARUSHIGE KEIJI
分类号 H01S5/024;H01L23/02;H01L23/08;H01L23/373 主分类号 H01S5/024
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