LEADFRAME SUBSTRATE AND METHOD FOR MANUFACTURING SAME, AND SEMICONDUCTOR DEVICE

摘要

A leadframe substrate is provided with: a metal plate having a first surface and a second surface; a semiconductor element mounting section, a semiconductor element electrode connecting terminal and a first outer frame section, which are formed on the first surface; an external connecting terminal which is formed on the second surface and is electrically connected with the semiconductor element electrode connecting terminal; a second outer frame section which is formed on the second surface; and a resin layer formed in a space between the first outer frame section and the second outer frame section.  On a side surface of the external connecting terminal embedded in a resin layer, at least one protruding section is formed toward the side bottom section of the first surface.