| 摘要 |
A via is provided on a printed circuit board with at least one additional depression encompassing the via, such that the via passes through a portion of the depression. Solder can pool in the depression, allowing for a stronger mechanical bond and eliminating many issues with respect to a lack of coplanarity between a lead and the printed circuit board. The depression can be provided with plugged and unplugged vias, and improves the mountings associated with both.
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