LEADFRAME SUBSTRATE AND METHOD FOR MANUFACTURING SAME

摘要

On a first surface of a metal plate, a photoresist pattern for forming a semiconductor element mounting section on which a semiconductor element is to be mounted, a semiconductor element electrode connecting terminal to be connected with an electrode of the semiconductor element, and a first outer frame section is formed.  On a second surface of the metal plate, a photoresist pattern for forming an external connecting terminal, a second outer frame section and a groove section on at least on a part of the second outer frame section is formed.  On a metal plate exposing section where the metal plate is exposed on the second surface, a hole section, which does not penetrate the metal plate exposing section, and a groove section, which traverses from the inner side to the outer side of the second outer frame section, are formed by etching, and a resin layer is formed on the hole section and the groove section by applying a pre-molded resin with heat and pressure by using a flat pressing machine.  The semiconductor element mounting section, the semiconductor element electrode connecting terminal to be electrically connected with the external connecting terminal, and the first outer frame section are formed by etching the first surface.