| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive thermocurable resin composition for solder resist with balanced functionality and coating capacity suitable for flexible printed circuit board, and to provide a compound which can give the cured product of the same. <P>SOLUTION: The multibranched polyester (meth)acrylate compound (A) is prepared by reacting a multibranched polyester polyol (a), a monoisocyanate containing a unsaturated group (b), and a polybasic anhydride (c). Also in one preferable embodiment of the compound, the reaction product of the multibranched polyester polyol (a) and the monoisocyanate containing a unsaturated group (b) is reacted with the polybasic anhydride (c). <P>COPYRIGHT: (C)2010,JPO&INPIT |
