| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To solve the problem that when a copper foil is overlaid on one surface of a both-side-copper-clad laminated board via prepreg and is pressed in manufacturing a three-layer wiring board, the prepreg shrinks when it is thermally cured to often cause the copper foil to bend toward the prepreg of the three-layer wiring board, thus deteriorating the precision of alignment and adjustment, such as the precision of pattern wiring, through-hole positioning, and pattern and solder resist printing, and to improve a warp prevention effect by solving the problem. <P>SOLUTION: A three-layer wiring board that is a lamination of a one-side-copper-clad laminated board and a both-side-copper-clad laminated board is formed by overlaying the side of the one-side-copper-clad laminated board that is opposite to its copper side, on the both-side-copper-clad laminated board via an adhesive layer. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
