发明名称 COMPLIANT MEMBRANE THIN FILM INTERPOSER PROBE FOR INTEGRATED CIRCUIT DEVICE TESTING
摘要 A method for fabricating a compliant membrane probe for communication with an integrated circuit includes installing an array of conductive structures within a flexible membrane, the conductors comprising a beam structure having a first end and a second end, with each one of the conductors further comprising a probe tip extending from the first end, the probe tip having a throat generally surrounded by material of the flexible membrane and a head at an end of the throat such that the head is disposed at an opposite side of the flexible membrane with respect to the beam structure; and configuring the second end of the beam structure so as to be supported by a first end of the beam structure of an adjacent conductor thereto.
申请公布号 US2010083496(A1) 申请公布日期 2010.04.08
申请号 US20090631916 申请日期 2009.12.07
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 AUDETTE DAVID M.;HAGIOS JOHN F.;SULLIVAN CHRISTOPHER L.
分类号 H05K3/20 主分类号 H05K3/20
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