METHOD FOR PREPARING A PATTERNED ELECTRIC CIRCUIT

摘要

The invention provides a method for preparing a pattern for an electric circuit comprising the steps of:
(a) providing a substrate onto which a coating has been applied;
(b) mechanically removing locally the coating to obtain a pattern for an electric circuit;
(c) establishing a distribution of particles of a first metal or alloy thereof on the coating and the pattern as obtained in step (b);
(d) removing the coating from the substrate; and
(e) depositing by means of an electroless process a layer of a second metal or alloy thereof on the particles of the first metal or alloy thereof that are distributed on the pattern in step (c).