发明名称 |
DIAPHRAGM STRUCTURE AND ACOUSTIC SENSOR |
摘要 |
A through-hole 102 is formed so as to penetrate from an upper surface to a bottom surface of a substrate 101. A vibrating electrode film 103 is formed on the substrate 101 so as to cover the through-hole 102. A portion of the vibrating electrode film 103, which is positioned on the through-hole 102, functions as a diaphragm 104. An opening shape of the through-hole 102 in the upper surface of the substrate 101 is hexagonal.
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申请公布号 |
EP2173114(A1) |
申请公布日期 |
2010.04.07 |
申请号 |
EP20070859774 |
申请日期 |
2007.12.11 |
申请人 |
PANASONIC CORPORATION |
发明人 |
YUSUKE, TAKEUCHI;HIROSHI, OGURA;YUISHI, MIYOSHI;TOHRU, YAMAOKA |
分类号 |
H04R19/04;G01L9/00;H01L29/84 |
主分类号 |
H04R19/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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