发明名称 DIAPHRAGM STRUCTURE AND ACOUSTIC SENSOR
摘要 A through-hole 102 is formed so as to penetrate from an upper surface to a bottom surface of a substrate 101. A vibrating electrode film 103 is formed on the substrate 101 so as to cover the through-hole 102. A portion of the vibrating electrode film 103, which is positioned on the through-hole 102, functions as a diaphragm 104. An opening shape of the through-hole 102 in the upper surface of the substrate 101 is hexagonal.
申请公布号 EP2173114(A1) 申请公布日期 2010.04.07
申请号 EP20070859774 申请日期 2007.12.11
申请人 PANASONIC CORPORATION 发明人 YUSUKE, TAKEUCHI;HIROSHI, OGURA;YUISHI, MIYOSHI;TOHRU, YAMAOKA
分类号 H04R19/04;G01L9/00;H01L29/84 主分类号 H04R19/04
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