| 摘要 |
PROBLEM TO BE SOLVED: To provide a corrosion resistant member having high corrosion resistance, and to provide a semiconductor fabrication apparatus using the same. SOLUTION: The corrosion resistant member includes a base material and a Y<SB>2</SB>O<SB>3</SB>film formed on the surface thereof, and the Y<SB>2</SB>O<SB>3</SB>film has crystals oriented to the 400 face on the surface, wherein the ratio of the crystals oriented to the vicinity of the 400 face in the orientation map obtained by measuring the surface of the Y<SB>2</SB>O<SB>3</SB>film by an EBSD (Electron Backscattor Diffraction) process is 5 to 50%. The semiconductor fabrication apparatus uses the corrosion resistant member for the part to be exposed to corrosive gas and the plasma thereof. COPYRIGHT: (C)2010,JPO&INPIT |
