发明名称 WIRE-CUTTING DISCHARGE MACHINING DEVICE, WIRE GUIDE ASSEMBLY, AND METHOD OF CLEANING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To clean wire powder generated in a wire guide assembly without being deposited on a wire guide in the wire guide assembly of a wire-cutting discharge machining device. Ž<P>SOLUTION: In the wire guide assembly 1 having wire passages (23b, 26, 32, 41, 63, 66a, and 71a) through which a traveling wire W passes, a cleaning liquid C is introduced to and discharged from an upper stream side in a traveling direction than the wire guide 6 which forms a part of the wire passages (23b, 26, 32, 41, 63, 66a, and 71a). Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010069541(A) 申请公布日期 2010.04.02
申请号 JP20080235889 申请日期 2008.09.16
申请人 SODICK CO LTD 发明人 SATO AKIRA;ARIKAWA YASUAKI
分类号 B23H7/10 主分类号 B23H7/10
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