| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a cooling unit for efficiently cooling a plurality of heat generation bodies, and to provide an electronic device with the cooling unit mounted thereon. <P>SOLUTION: The cooling unit includes: a radiation part 515 where a cooling liquid flows inside and the heat of the cooling liquid is radiated to an external part; a channel for guiding the cooling liquid by circulation, including a first pipe 516 for guiding the cooling liquid from the radiation part 515 to the external part and the second pipe 517 for guiding the cooling liquid to the inner part; a pump 518 arranged on the channel so as to allow the cooling liquid in the channel to flow along the channel; and a heat absorption part 511 for a CPU and a heat absorption part 512 for a chip set which have contact with the CPU 111 and the chip set 112, and where the cooling liquid flows inside, so as to absorb the heat of the electronic components to the cooling liquid. The heat absorption part 511 for the CPU is arranged on the downstream side of the pump 518 and on the upstream side of the radiation part 515, and the heat absorption part 512 for the chip set is arranged at a part on the upstream side of the pump 518 and on the downstream side of the radiation part 515. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
