| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device improving heat dissipation of a semiconductor chip which is flip-chip mounted. <P>SOLUTION: The semiconductor device includes a semiconductor chip 1 mounted by flip chip bonding, a chip carrier provided to it, and a refrigerant path which is thermally connected to the back face of the semiconductor chip 1 and has a refrigerant. In the semiconductor device, the refrigerant is in contact with the back face of the semiconductor chip 1 directly or via a metal thin film 8, and a part of the refrigerant path is made of a space made by a refrigerant path member 5 and the back face of the semiconductor chip 1. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
