| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a jig for semiconductor wafers which reduces a burden of management for a processing apparatus. <P>SOLUTION: The jig for semiconductor wafers includes a wafer storage opening 1a which is formed in a plate and has one surface side wider than that of the other, and a tape sticking region provided in an area including the wafer storage opening 1a and its periphery at one surface side. A tape 10 is stuck to the tape sticking region to fix a semiconductor wafer 20 after the semiconductor wafer 20 is attached to the wafer storage opening 1a, so that the semiconductor wafer not conforming to specifications can be processed. <P>COPYRIGHT: (C)2010,JPO&INPIT |
