| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which is excellent in photosensitivity and capable of obtaining a cured material excellent in both of electroless plating resistance and peeling property, and a photosensitive element and a method for manufacturing a printed wiring board using the same. <P>SOLUTION: The photosensitive resin composition includes (A) a binder polymer, (B) a photopolymerizable compound having a polymerizable ethylenically unsaturated group, and (C) a photopolymerization initiator, wherein the component (B) includes a bisphenol A-based (meth)acrylate compound, an alkoxylated trimethylolpropane tri(meth)acrylate compound, and a nonylphenylpolyalkylene glycol (meth)acrylate compound, and the component (C) includes an acridine compound. <P>COPYRIGHT: (C)2010,JPO&INPIT |
