发明名称 SURFACE-MOUNTED COIL COMPONENT
摘要 <P>PROBLEM TO BE SOLVED: To prevent mounting defects accompanying the lifting of a terminal upon mounting while securing such a projection amount of a mounting part that soldering of a terminal to be mounted on a substrate and image recognition can be executed. Ž<P>SOLUTION: A plurality of terminals 50 held in parallel with a terminal holding part 60 are provided with an entanglement part 52 to which a winding wire end part of a coil 20 is connected and a mounting part 53 bonded to a substrate. The bottom part bonding surface 53A of the mounting part is disposed along the bottom surface of the terminal holding part 60, the distal end part of the mounting part 53 is projected exposing a length required for image recognition and soldering at the side part of the terminal holding part 60, the upper surface 53B of the mounting part 53 is pressed by being abutted to the bottom surface of a pressing part 62 projected on the side end face of the terminal holding part 60, and lifting deformation due to thermal influence or the like during mounting is suppressed. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010073778(A) 申请公布日期 2010.04.02
申请号 JP20080237645 申请日期 2008.09.17
申请人 SUMIDA CORPORATION 发明人 IWABUCHI TAKESHI;SUGANO TOMOSHI
分类号 H01F27/29 主分类号 H01F27/29
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