| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which exhibits excellent hydrofluoric acid resistance even in a small film thickness, and to provide a method for producing a glass substrate to be processed using the photosensitive resin composition. <P>SOLUTION: The photosensitive resin composition includes an alkali-soluble resin (A) prepared by reacting an acid radical-containing acrylic resin with an alicyclic epoxy group-containing unsaturated compound, a monomer (B) of trifunctional or more, a photopolymerization initiator (C), and an aminosilane coupling agent (D) having a group represented by formula (1) or (2) at an end. In the formulae (1) and (2), R<SP>1</SP>and R<SP>2</SP>are each independently H or 1-5C alkyl. <P>COPYRIGHT: (C)2010,JPO&INPIT |
