| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide packaged micro movable device manufacturing method and packaged micro movable device suitable for thinning a package. <P>SOLUTION: A packaged device PD includes device layer parts (a device D and an outer wall part 70) and packaging members 80 and 90 joined to the device layer parts. In this manufacturing method, a wiring region 81A surrounded by a separation groove is formed in a first packaging wafer, and an insulating part 82 is formed in the separation groove. A side formed with the wiring region 81A in the first packaging wafer is joined to the first surface side of a device wafer including a plurality of sections to form the device D. In the first packaging wafer, a through hole passing through the wafer by passing the wiring region 81A is formed, and a conductive material 85 is filled into the through hole. A second packaging wafer is joined to the second surface side of the device wafer, and the first packaging wafer is made thin to expose the wiring region 81A. <P>COPYRIGHT: (C)2010,JPO&INPIT |
