| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of improving the adhesion between a semiconductor chip and a resin sealing the chip. <P>SOLUTION: A manufacturing method for a resin sealing semiconductor device includes a step of arranging a substrate 1 having a first electrode on its main surface and a semiconductor chip 4 having a second electrode on its first main surface to set the main surface and the first main surface opposite to each other and connecting the first electrode to the second electrode, a step of grinding the second main surface opposite to the first main surface to reduce the thickness of the semiconductor chip 4 while the semiconductor chip 4 is connected to the substrate 1, and a step of sealing the side faces and second main surface of the semiconductor chip 4 with a resin after reducing the thickness of the semiconductor chip 4. <P>COPYRIGHT: (C)2010,JPO&INPIT |
