| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin molded semiconductor sensor that reduces unnecessary stress acting on a semiconductor sensor element and increases the environment resistance, and to provide a method of manufacturing the sensor. <P>SOLUTION: A first package 10 formed by molding the semiconductor sensor element 12 or the like with a first resin material 17 for preventing electromagnetic leak, and a second package 30 that forms a storage section 31 for storing the first package and is made of the second resin material 32 are molded separately. The first package is inserted into the second package from an opening 31a of the storage section, and a resin mold semiconductor sensor is prepared. In the storage state, a void 33 is formed between the outer surface of the first package and the inner surface of the storage section. <P>COPYRIGHT: (C)2010,JPO&INPIT |
