发明名称 APPARATUS FOR CLAMPING A SUBSTRATE USING VACUUM FORCE
摘要 PURPOSE: The substrate clamping mechanism of the vacuum pressure mode grips substrate by using the vacuum pressure or the pneumatic air pressured without the separate clamp tool. The configuration of the apparatus is simplified. CONSTITUTION: A substrate clamping mechanism(1000) comprises the supporting part(100), and the clamp(200) and driving part(300). The supporting part supports substrate. It is arranged on the supporting part and clamp grips the edge of substrate site. The driving part is connected to clamp. By being driven with the driving part and using the vacuum pressure or pneumatic, clamp grips the edge of substrate site.
申请公布号 KR20100034785(A) 申请公布日期 2010.04.02
申请号 KR20080093952 申请日期 2008.09.25
申请人 SECRON CO., LTD. 发明人 MUN, GANG HYUN
分类号 H01L21/687 主分类号 H01L21/687
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