SEMICONDUCTOR PACKAGE METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: A semiconductor package and a manufacturing method thereof laminate package to the stacking structure which chops and is. The package war page phenomenon and form factor are reduced. CONSTITUTION: A first package(100) comprises one or more first semiconductor chip(110). A second package(300) comprises the outer connector and one or more second semiconductor chip. The second package is laminated on the first semiconductor package. It is arranged between the first and the second package and the interposer(200) is connected to the outer connector. The first and the second package are connected electrically. With an intermediation connection pad which is connected to the outer connector and interposer is electrically connected to the second package.