发明名称 SUBSTRATE PROCESSING APPARATUS
摘要 Disclosed is a substrate processing apparatus which can inhibit the occurrence of spots, such as watermarks, by reducing the remaining of the liquid that has been used for liquid treatment, inhibit the turn-over of the wafer, and improve throughput. In the disclosed substrate processing apparatus including a carrying means for carrying a semiconductor wafer W while vertically holding the wafer, a wafer boat (a carrying means) includes lower holders holding the bottom portion of the wafer, and a couple of left/right upper holders for holding the bottom outer edges of the wafer when the wafer is turned over. The lower holder includes a holding groove part and a turn-over prevention groove part, which are integrally formed with each other. The holding groove part includes holding grooves directly holding the bottom portion of the wafer, and the turn-over prevention groove part is disposed adjacent to the holding groove part and includes turn-over prevention grooves for holding the wafer when the holding of the wafer by the holding grooves has been released.
申请公布号 US2010078867(A1) 申请公布日期 2010.04.01
申请号 US20090562818 申请日期 2009.09.18
申请人 TOKYO ELECTRON LIMITED 发明人 NAKASHIMA MIKIO
分类号 B23Q3/00 主分类号 B23Q3/00
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