APPARATUS AND METHOD FOR MOUNTING ELECTRONIC COMPONENT

摘要

An apparatus for mounting an electronic component is provided with: a punching apparatus (5A, 5B) which is arranged at one end of an apparatus main body (1) and punches out a TCP from a carrier tape (3); a first receiving/transferring means (6A, 6B) which receives the punched out TCP and transfers the TCP to a predetermined position; an index means (18A, 18B) having a plurality of holding heads which receive and hold the transferred TCPs; an adhering apparatus (31A, 31B) which adheres the adhesive tape on the TCPs which have been transferred to the holding heads; a table apparatus which receives and aligns a substrate; a mounting head (53) which mounts the TCP having the adhesive tape adhered thereon on the substrate which has been aligned by the table apparatus; a gas-supplying unit (72) which introduces an external gas into an apparatus main body from above the apparatus main body, and makes the gas flow downward along the punching apparatus; and a gas-releasing unit (77) which ejects, from a bottom section, dusts generated in the apparatus main body due to such flow.