发明名称 HEAT SINK MOUNTING STRUCTURE AND ELECTRONIC APPARATUS
摘要 According to one embodiment, a heat sink mounting structure for mounting a heat sink for radiating heat from a heat-generating part on a printed circuit board in the heat-generating part, comprises a hook, a conductive clip, a power supply and a detector. The hook is formed close to the heat-generating part. The conductive clip presses and secures the heat sink to the heat-generating part by a stress produced when hanging on the hook. The power supply applies a voltage to the clip. The detector detects detachment of the heat sink from the heat-generating part, when no current flows from the power supply to the clip through the hook.
申请公布号 US2010079133(A1) 申请公布日期 2010.04.01
申请号 US20090566489 申请日期 2009.09.24
申请人 KADOSHIMA HIROTAKA 发明人 KADOSHIMA HIROTAKA
分类号 G01R19/155;H05K7/20 主分类号 G01R19/155
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