发明名称 |
SEMICONDUCTOR DEVICE ASSEMBLIES, ELECTRONIC DEVICES INCLUDING THE SAME AND ASSEMBLY METHODS |
摘要 |
A semiconductor device is formed of two or more dice of similar dimensions and bond pad arrangements, in which bond pads are located in fields along less than three edges of the active surface of each die. A first die is attached to a substrate and subsequent die or dice are attached in a vertical sequence atop the first die, each in an offset configuration from the next lower die to expose the bond pads thereof for conductive bonding to metallization of the substrate. The multiple chip device permits a plurality of dice to be stacked in a high-density low-profile device. A particularly useful application is the formation of a stacked mass storage flash memory package.
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申请公布号 |
US2010078793(A1) |
申请公布日期 |
2010.04.01 |
申请号 |
US20090631296 |
申请日期 |
2009.12.04 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
MESS LEONARD E.;BROOKS JERRY M.;CORISIS DAVID J. |
分类号 |
H01L25/065;H01L21/822;H01L23/495;H01L29/06 |
主分类号 |
H01L25/065 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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