发明名称 SUBSTRATE MODULE AND METHOD FOR MANUFACTURING THE SAME
摘要 <p>A liquid crystal display device (100) is provided with a glass substrate (110) having an LSI chip (130) and an FPC substrate (140) mounted thereon.  An ACF (150a) composed of one sheet for a component is used for further mounting a separate electronic component, such as a stabilizing capacitor (150), on the glass substrate (110).  The ACF (150a) is in a size large enough for covering not only a region where the separate electronic component is to be mounted but also an upper surface of the LSI chip (130) previously mounted and that of an FPC substrate (140).  Since positional restriction in attaching the ACF (150a) to the glass substrate (110) is eliminated when such large ACF (150a) is used, the area of a region whereupon the electronic component is to be mounted can be reduced.  Thus, a small substrate module wherein the area of the region whereupon the electronic component is to be mounted is reduced is provided.</p>
申请公布号 WO2010035551(A1) 申请公布日期 2010.04.01
申请号 WO2009JP60092 申请日期 2009.06.02
申请人 SHARP KABUSHIKI KAISHA;SHIOTA, MOTOJI;NAGAOKA, GEN;UMEKAWA, ICHIRO;HIDA, YASUHIRO;SHIMIZU, YUKIO 发明人 SHIOTA, MOTOJI;NAGAOKA, GEN;UMEKAWA, ICHIRO;HIDA, YASUHIRO;SHIMIZU, YUKIO
分类号 H05K3/32;G02F1/1345;H01L21/60;H05K1/14;H05K3/36 主分类号 H05K3/32
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