LED LUMINAIRE AND MANUFACTURING METHOD FOR SAME

摘要

The present invention relates to an LED luminaire using an LED package, in which the heat generated from LEDs for lighting is efficiently dissipated to maximize the light emitting characteristics and lifespan thereof, and to a manufacturing method for same. The luminaire of the present invention includes an LED package, a heat dissipation unit, a globe, and a screw cap. The LED package has a plurality of LEDs, a board, and a heat conducting unit. The board is formed into a polygonal shape, has one surface on which a wiring is arranged to apply power to the plurality of LEDs, and is mounted with the plurality of LEDs. The heat conducting unit is tightly arranged on an inner surface of the board, and contacts an atmosphere. The heat dissipation unit dissipates heat generated from the LED package. The globe encases the LED package. The screw cap is coupled onto the top of the heat dissipation unit, and fitted to a socket.