发明名称 |
LED PACKAGE |
摘要 |
The present invention has an object to provide a LED package having a means capable of precisely limiting a region in which a resin containing a phosphor is dotted on a member on which an LED chip is supported. To this end, an LED package according to the present invention comprises a package body having an inner space with an LED chip mounted therein, the inner space being open toward a light emission direction; a chip support member mounted to the inner space of the package body to support the LED chip; a phosphor resin member formed by dotting resin containing a phosphor onto the LED chip; and a region limitation means provided on the chip support member and defining a region in which the phosphor resin member is formed.
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申请公布号 |
US2010072499(A1) |
申请公布日期 |
2010.03.25 |
申请号 |
US20070443293 |
申请日期 |
2007.09.27 |
申请人 |
SEOUL SEMICONDUCTOR CO., LTD. |
发明人 |
KWON YOU JIN;SEO JUNG HU;PYO BYOUNG KI;CHO KANG HYUN |
分类号 |
H01L33/00;H01L33/48;H01L33/50;H01L33/54;H01L33/56;H01L33/60;H01L33/64 |
主分类号 |
H01L33/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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